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Typical Thermal Characteristics
12
3.5
9
6
3
V DS = -10V
T J = -55°C
25°C
125°C
3
2.5
2
1.5
1b
1a
T A = 2 5 C
1
1c
4.5"x5" FR-4 Board
o
2oz COPPER MOUNTING PAD AREA (in )
0
0
-4
-8 -12
I D , DRAIN CURRENT (A)
-16
-20
0.5
0
0.2 0.4 0.6 0.8
Still Air
2
1
Figure 13. Transconductance Variation with Drain
Current and Temperature.
6
Figure 14. SOT-223 Maximum Steady- tate
Power Dissipation versus Copper
Mounting Pad Area.
50
1m
5
1a
20
10
5
RD
S(O
N)
LIM
IT
10
100
s
ms
us
4
1
0.5
10
1s
0m
s
3
1c
1b
4.5"x5" FR-4 Board
0.1
V GS = -10V
SINGLE PULSE
1 0 s
DC
T A = 2 5 C
θ J A
o
Still Air
V G S = - 1 0 V
0.05
R
= See Note 1c
T A = 25°C
2
0
0.2
0.4
0.6
0.8
1
0.01
0.1
0.2
0.5
1
2
5
10
30
50
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 15. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
1
- V DS , DRAIN-SOURCE CURRENT (V)
Figure 16. Maximum Safe Operating Area.
0.5
D = 0.5
R JA (t) = r(t) * R JA
θ
0.2
0.1
0.05
0.02
0.2
0.1
0.05
0.02
P(pk)
θ θ
R JA = See Note 1 c
0.01
0.01
t 1
t 2
T J - T A = P * R
θ JA
0.005
0.002
0.001
Single Pulse
(t)
Duty Cycle, D = t 1 / t 2
0.0001
0.001
0.01
0.1
1
10
100
300
t 1 , TIME (sec)
Figure 17. Transient Thermal Response Curve .
Note:
Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDT452AP Rev. B1
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